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Stress Intensity of Delamination in a Sintered-Silver Interconnection
Douglas DeVoto
,
Paul Paret
, A. Wereszczak
Center for Integrated Mobility Sciences
Oak Ridge National Laboratory
University of Tennessee, Knoxville
Research output
:
Contribution to conference
›
Paper
›
peer-review
3
Scopus Citations
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Dive into the research topics of 'Stress Intensity of Delamination in a Sintered-Silver Interconnection'. Together they form a unique fingerprint.
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Engineering
Bonded Interface
100%
Stress Intensity
100%
Delamination
100%
Power Electronics
66%
Thermal Performance
66%
Automotives
33%
Baseplate
33%
Thermal Cycle
33%
Finite Element Modeling
33%
Material Layer
33%
Coefficient of Thermal Expansion
33%
Material Interface
33%
Grease
33%
Adhesive Stress
33%
Cohesive Stress
33%
Heat Removal
33%
Crack Propagation
33%
Stress-Intensity Factor
33%
Crack Initiation
33%
Velocity (V)
33%
Crack Velocity
33%
Electronic Packaging
33%
Degradation Rate
33%
Phase Change Material
33%
Heat Resistance
33%
Material Science
Thermal Expansion
100%
Heat Resistance
100%
Interface (Material)
100%
Finite Element Modeling
100%
Phase Change Material
100%
Stress Intensity Factor
100%
Crack Initiation
100%
Crack Propagation
100%
Stress Intensity
100%
Delamination
100%