Reliability Analysis of Large-Area, Low Pressure-Assisted Silver Sintering for Medium-Voltage Power Modules

Engineering

• Adhesive Failure 50%
• Aluminum Substrate 50%
• Cross Section 100%
• Defect Density 50%
• Electric Field 50%
• Heat Losses 50%
• Insulating Layer 50%
• Laminate 50%
• Metal-Oxide-Semiconductor Field-Effect Transistor 50%
• Operating Voltage 50%
• Optical Microscope 50%
• Reliability Analysis 100%
• Sintering 100%
• Thermal Cycle 50%
• Thermal Performance 50%

Material Science

• Aluminum 100%
• Ceramic Substrate 33%
• Defect Density 33%
• Laminate 33%
• Metal-Oxide-Semiconductor Field-Effect Transistor 33%
• Multilayers 66%
• Scanning Electron Microscopy 66%
• Silicon Carbide 66%
• Sintering 100%
• Surface (Surface Science) 33%
• Thermal Cycling 66%