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Properties of Substrate-Type a-Si:H Devices Prepared Using ECR Conditions
NREL
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Engineering
Dilution
100%
Band Gap
100%
Fill Factor
50%
Hydrogen Dilution
50%
Gas Plasma
50%
Quantum Efficiency
50%
Stainless Steel
50%
Material Science
Dilution
100%
Film
33%
Stainless Steel
33%
Plasma Deposition
33%