Skip to main navigation Skip to search Skip to main content

Power Electronic Development Challenges for High Power Density Integrated Electric Drive Applications

  • Oak Ridge National Laboratory

Research output: Contribution to conferencePaper

Abstract

The ever-increasing demand for compact, efficient, and high-performance traction drive systems for transportation applications has accelerated the development of integrated electric drives. In these systems, the electric machine and inverter are integrated within a single housing, offering significant advantages in electrical performance, volume, weight, cost, and overall system efficiency. Despite these benefits, such high levels of integration introduce a new set of challenges, particularly in power electronic design and component selection. This article presents an in-depth investigation of a highly integrated electric drive architecture with an internal stator-mounted inverter, highlighting key design considerations and trade-offs aimed exclusively at maximizing system power density.Based on a comprehensive review of the literature, the power density of a voltage-source-inverter-driven electric drive is primarily governed by the volumetric contributions of the power modules, heat sinks, and DC-link capacitors. Accordingly, this work focuses on the optimization of these three critical components to enhance the inverter's overall power density. The proposed design achieves a power density of 100 kW/L, demonstrating the effectiveness of the presented approach for next-generation integrated electric drive systems.
Original languageAmerican English
Pages1724-1731
Number of pages8
DOIs
StatePublished - 2026
EventIEEE Applied Power Electronics Conference and Exposition - San Antonio, TX
Duration: 22 Mar 202626 Mar 2026

Conference

ConferenceIEEE Applied Power Electronics Conference and Exposition
CitySan Antonio, TX
Period22/03/2626/03/26

NLR Publication Number

  • NLR/CP-5700-98770

Keywords

  • capacitor packaging
  • direct-bonded aluminum
  • direct-bonded copper
  • integrated electric drive
  • power electronic substrate

Fingerprint

Dive into the research topics of 'Power Electronic Development Challenges for High Power Density Integrated Electric Drive Applications'. Together they form a unique fingerprint.

Cite this