Skip to main navigation Skip to search Skip to main content

Performance Modeling of Tandem Photovoltaics: A Yearlong Outdoor Degradation Analysis of a GaAs//Si Minimodule: Article No. 023014

Research output: Contribution to journal › Article › peer-review

Abstract

We present a performance modeling and degradation analysis framework for tandem photovoltaic modules, building upon established procedures for crystalline silicon devices and adapting them to account for the spectral sensitivity of multijunction technologies. The methodology employs filter criteria to select outdoor measurements close to standard test conditions (STC) under stable spectral and ambient conditions, followed by normalization of power production data with corrections for temperature, irradiance, and precipitable water vapor. We demonstrate this framework using a mechanically stacked four-terminal gallium arsenide (Ga?As) // silicon (Si) tandem solar minimodule deployed outdoors from October 2019 to January 2021 in Golden, Colorado, USA. We determined degradation rates of -4.1 +-0.2%/year for the Ga?As subcell and -2.5 +-0.9%/year for the Si subcell, with analysis of individual performance metrics indicating that packaging degradation, particularly delamination, was the dominant failure mode. Simulations using PVcircuit, an open-source equivalent-circuit solver, confirmed these findings. The presented methodology provides a reproducible foundation for performance modeling and degradation analysis of emerging tandem technologies.
Original languageAmerican English
Number of pages13
JournalPRX Energy
Volume5
DOIs
StatePublished - 2026

NLR Publication Number

  • NLR/JA-5K00-93185

Keywords

  • degradation rate
  • filter criteria
  • GaAs
  • III-V
  • mini-module
  • performance
  • silicon
  • standard test conditions
  • tandem

Fingerprint

Dive into the research topics of 'Performance Modeling of Tandem Photovoltaics: A Yearlong Outdoor Degradation Analysis of a GaAs//Si Minimodule: Article No. 023014'. Together they form a unique fingerprint.

Cite this