Molecular Dynamics Modeling of Heat Transport in Metals and Semiconductors: Paper No. IHTC14-23314

Engineering

• Thermal Conductivity 100%
• Heat Transport 100%
• Hybrid Electric Vehicle 50%
• Power Electronics 50%
• Numerical Study 50%
• Heat Losses 50%
• Dispersion Curve 50%
• Phonon Dispersion 50%
• Interfacial Resistance 50%
• Good Match 50%
• Great Importance 50%
• Thermal Impact 50%

Material Science

• Silicon 100%
• Aluminum 83%
• Thermal Conductivity 33%
• Metal Interface 16%

Chemical Engineering

• Thermal Conductivity 100%
• Chilling 50%