@misc{688a806990d5401b8650389668766f64,
title = "Module Encapsulation Materials, Processing and Testing (Presentation)",
abstract = "Study of PV module encapsulation materials, processing, and testing shows that overall module reliability is determined by all component materials and processing factors.",
keywords = "field degradation, materials, module construction, module encapsulation, module lamination, processing, PV, testing",
author = "John Pern",
year = "2008",
language = "American English",
series = "Presented at the APP International PV Reliability Workshop, 4-5 December 2008, Shanghi, China",
type = "Other",
}