Abstract
A method of producing epitaxial silicon films on a c-Si wafer substrate using hot wire chemical vapor deposition by controlling the rate of silicon deposition in a temperature range that spans the transition from a monohydride to a hydrogen free silicon surface in a vacuum, to obtain phase-pure epitaxial silicon film of increased thickness is disclosed.
| Original language | American English |
|---|---|
| Patent number | 7,601,215 B1 |
| State | Published - 2009 |
NLR Publication Number
- NREL/PT-520-47026
Fingerprint
Dive into the research topics of 'Method for Rapid, Controllable Growth and Thickness, of Epitaxial Silicon Films'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver