I.1.7 - Advanced Packaging Designs - Reliability and Prognostics (National Renewable Energy Laboratory)

Douglas DeVoto; Susan Rogers

I.1.7 - Advanced Packaging Designs - Reliability and Prognostics (National Renewable Energy Laboratory)

Douglas DeVoto
, Susan Rogers

Center for Integrated Mobility Sciences

United States Department of Energy

Research output: NLR › Management

Abstract

The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

Original language	American English
Number of pages	8
State	Published - 2022

Bibliographical note

Progress report for the DOE Vehicle Technologies Office Electrification Annual Progress Report (DOE/EE-2614)

NLR Publication Number

NREL/MP-5400-81167

Keywords

interconnects
packaging
power electronics
reliability
substrates

Access to Document

https://www.energy.gov/eere/vehicles/articles/2021-electrification-annual-progress-report

Cite this

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title = "I.1.7 - Advanced Packaging Designs - Reliability and Prognostics (National Renewable Energy Laboratory)",

abstract = "The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.",

keywords = "interconnects, packaging, power electronics, reliability, substrates",

author = "Douglas DeVoto and Susan Rogers",

note = "Progress report for the DOE Vehicle Technologies Office Electrification Annual Progress Report (DOE/EE-2614)",

year = "2022",

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T1 - I.1.7 - Advanced Packaging Designs - Reliability and Prognostics (National Renewable Energy Laboratory)

AU - DeVoto, Douglas

AU - Rogers, Susan

N1 - Progress report for the DOE Vehicle Technologies Office Electrification Annual Progress Report (DOE/EE-2614)

PY - 2022

Y1 - 2022

N2 - The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

AB - The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

KW - interconnects

KW - packaging

KW - power electronics

KW - reliability

KW - substrates

M3 - Management

ER -

I.1.7 - Advanced Packaging Designs - Reliability and Prognostics (National Renewable Energy Laboratory)

Abstract

Bibliographical note

NLR Publication Number

Keywords

Access to Document

Fingerprint

Cite this