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Exploring the Performance and Reliability of Screen-Printable Fire-Through Copper Paste on PERC Solar Cells

  • Suchismita Mitra
  • , Steve Johnston
  • , Harvey Guthrey
  • , Peter Hacke
  • , Ruvini Dharmadasa
  • , Thad Druffel
  • , Kevin Elmer
  • , Apolo Nambo
  • , Dustin Williams
  • , Ajay Upadhyaya
  • , Vijaykumar Upadhyaya
  • , Ajeet Rohatgi
  • , Paul Stradins
  • National Renewable Energy Laboratory
  • Bert Thin Films
  • Georgia Institute of Technology

Research output: NLRPoster

Abstract

For 40 TW of PV required to transition our planet to 100% renewables, the silver (Ag) should disappear from PV production. Advantages of copper (Cu) over silver (Ag) include 1) bulk Cu has a similar conductivity to Ag (1.7 mu O-cm for Cu, 1.6 mu O-cm for Ag) and 2) Cu is approximately 100 times cheaper than Ag, making it an excellent potential replacement. Problems associated with copper (Cu) contacts include 1) easy oxidation and 2) diffusion into the Si cell and recombination activity.
Original languageAmerican English
PublisherNational Laboratory of the Rockies (NLR)
StatePublished - 2024

Publication series

NamePresented at the 52nd IEEE Photovoltaic Specialists Conference (PVSC52), 9-14 June 2024, Seattle, Washington

NLR Publication Number

  • NREL/PO-5900-90132

Keywords

  • copper paste
  • fire-through
  • PERC
  • photovoltaic
  • PV
  • screen-printable
  • solar cell

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