Abstract
The present disclosure relates generally to methods and devices for the cooling (or removal of heat from) power electronics modules in automotive vehicles, wherein the cooling is done by positioning the power electronics module in a housing, directing a fluid into the housing, and impinging the fluid onto the power electronics module and/or an electrical connection in contact with the power electronics module.
| Original language | American English |
|---|---|
| Patent number | 12,004,332 B2 |
| Filing date | 4/06/24 |
| State | Published - 2024 |
NLR Publication Number
- NREL/PT-5400-90172
Keywords
- manifold
- power electronics module
- synthetic hydrocarbon
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