Analyses of Diamond Wire Sawn Wafers: Effect of Various Cutting Parameters

Santosh Sahoo; James Gee; Hubert Seigneur; Rekha Schnepf; Ferdinando Severico; Antoine Manens; Winston Schoenfeld; Steve Preece

doi:10.1109/PVSC.2015.7356033

Analyses of Diamond Wire Sawn Wafers: Effect of Various Cutting Parameters

Santosh Sahoo
, James Gee
, Hubert Seigneur
, Rekha Schnepf
, Ferdinando Severico
, Antoine Manens
, Winston Schoenfeld
, Steve Preece

Materials Science

Applied Materials
Photovoltaic Manufacturing Consortium
National Renewable Energy Laboratory

Research output: Contribution to conference › Paper

22 Scopus Citations

Abstract

We have evaluated surface characteristics of diamond wire cut (DWC) wafers sawn under a variety of cutting parameters. These characteristics include surface roughness, spatial frequencies of surface profiles, phase changes, damage depth, and lateral non-uniformities in the surface damage. Various cutting parameters investigated are: wire size, diamond grit size, reciprocating frequency, feed rate, and wire usage. Spatial frequency components of surface topography/roughness are influenced by individual cutting parameters as manifested by distinct peaks in the Fourier transforms of the Dektak profiles. The depth of damage is strongly controlled by diamond grit size and wire usage and to a smaller degree by the wire size.

Original language	American English
Number of pages	6
DOIs	https://doi.org/10.1109/PVSC.2015.7356033
State	Published - 2015
Event	2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC) - New Orleans, Louisiana Duration: 14 Jun 2015 → 19 Jun 2015

Conference

Conference	2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC)
City	New Orleans, Louisiana
Period	14/06/15 → 19/06/15

NLR Publication Number

NREL/CP-5J00-63642

Keywords

damage
diamond
FFT
silicon
wire sawing

Access to Document

10.1109/PVSC.2015.7356033

Cite this

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title = "Analyses of Diamond Wire Sawn Wafers: Effect of Various Cutting Parameters",

abstract = "We have evaluated surface characteristics of diamond wire cut (DWC) wafers sawn under a variety of cutting parameters. These characteristics include surface roughness, spatial frequencies of surface profiles, phase changes, damage depth, and lateral non-uniformities in the surface damage. Various cutting parameters investigated are: wire size, diamond grit size, reciprocating frequency, feed rate, and wire usage. Spatial frequency components of surface topography/roughness are influenced by individual cutting parameters as manifested by distinct peaks in the Fourier transforms of the Dektak profiles. The depth of damage is strongly controlled by diamond grit size and wire usage and to a smaller degree by the wire size.",

keywords = "damage, diamond, FFT, silicon, wire sawing",

author = "Santosh Sahoo and James Gee and Hubert Seigneur and Rekha Schnepf and Ferdinando Severico and Antoine Manens and Winston Schoenfeld and Steve Preece",

year = "2015",

doi = "10.1109/PVSC.2015.7356033",

language = "American English",

note = "2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC) ; Conference date: 14-06-2015 Through 19-06-2015",

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TY - CONF

T1 - Analyses of Diamond Wire Sawn Wafers: Effect of Various Cutting Parameters

AU - Sahoo, Santosh

AU - Gee, James

AU - Seigneur, Hubert

AU - Schnepf, Rekha

AU - Severico, Ferdinando

AU - Manens, Antoine

AU - Schoenfeld, Winston

AU - Preece, Steve

PY - 2015

Y1 - 2015

N2 - We have evaluated surface characteristics of diamond wire cut (DWC) wafers sawn under a variety of cutting parameters. These characteristics include surface roughness, spatial frequencies of surface profiles, phase changes, damage depth, and lateral non-uniformities in the surface damage. Various cutting parameters investigated are: wire size, diamond grit size, reciprocating frequency, feed rate, and wire usage. Spatial frequency components of surface topography/roughness are influenced by individual cutting parameters as manifested by distinct peaks in the Fourier transforms of the Dektak profiles. The depth of damage is strongly controlled by diamond grit size and wire usage and to a smaller degree by the wire size.

AB - We have evaluated surface characteristics of diamond wire cut (DWC) wafers sawn under a variety of cutting parameters. These characteristics include surface roughness, spatial frequencies of surface profiles, phase changes, damage depth, and lateral non-uniformities in the surface damage. Various cutting parameters investigated are: wire size, diamond grit size, reciprocating frequency, feed rate, and wire usage. Spatial frequency components of surface topography/roughness are influenced by individual cutting parameters as manifested by distinct peaks in the Fourier transforms of the Dektak profiles. The depth of damage is strongly controlled by diamond grit size and wire usage and to a smaller degree by the wire size.

KW - damage

KW - diamond

KW - FFT

KW - silicon

KW - wire sawing

U2 - 10.1109/PVSC.2015.7356033

DO - 10.1109/PVSC.2015.7356033

M3 - Paper

T2 - 2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC)

Y2 - 14 June 2015 through 19 June 2015

ER -

Analyses of Diamond Wire Sawn Wafers: Effect of Various Cutting Parameters

Abstract

Conference

NLR Publication Number

Keywords

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