2025 InterPACK: Thermal Management and Reliability Aspects

Gilbert Moreno; Rajneesh Chaudhary; Doug DeVoto; Xuhui Feng; Bidzina Kekelia; Paul Paret; Gui-Jia Su

doi:10.2172/3015059

2025 InterPACK: Thermal Management and Reliability Aspects

Center for Energy Conversion and Storage Systems

National Laboratory of the Rockies
Oak Ridge National Laboratory

Research output: NLR › Presentation

Abstract

The presentation will provide an overview of automotive power electronics and electric machines thermal management systems that are typical for light-duty vehicles. Unique thermal and environmental aspects related to medium and heavy-duty vehicle applications will then be discussed. Finally, advanced thermal management and packaging technologies that could be evaluated and used in this project will be described.

Original language	American English
Number of pages	15
DOIs	https://doi.org/10.2172/3015059
State	Published - 2025

Publication series

Name	Presented at the International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), 28-30 October 2025, Anaheim, California

NLR Publication Number

NLR/PR-5700-97707

Keywords

electric machine
power electronics
reliability
thermal management

Access to Document

10.2172/3015059

Cite this

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abstract = "The presentation will provide an overview of automotive power electronics and electric machines thermal management systems that are typical for light-duty vehicles. Unique thermal and environmental aspects related to medium and heavy-duty vehicle applications will then be discussed. Finally, advanced thermal management and packaging technologies that could be evaluated and used in this project will be described.",

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author = "Gilbert Moreno and Rajneesh Chaudhary and Doug DeVoto and Xuhui Feng and Bidzina Kekelia and Paul Paret and Gui-Jia Su",

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AU - Moreno, Gilbert

AU - Chaudhary, Rajneesh

AU - DeVoto, Doug

AU - Feng, Xuhui

AU - Kekelia, Bidzina

AU - Paret, Paul

AU - Su, Gui-Jia

PY - 2025

Y1 - 2025

N2 - The presentation will provide an overview of automotive power electronics and electric machines thermal management systems that are typical for light-duty vehicles. Unique thermal and environmental aspects related to medium and heavy-duty vehicle applications will then be discussed. Finally, advanced thermal management and packaging technologies that could be evaluated and used in this project will be described.

AB - The presentation will provide an overview of automotive power electronics and electric machines thermal management systems that are typical for light-duty vehicles. Unique thermal and environmental aspects related to medium and heavy-duty vehicle applications will then be discussed. Finally, advanced thermal management and packaging technologies that could be evaluated and used in this project will be described.

KW - electric machine

KW - power electronics

KW - reliability

KW - thermal management

U2 - 10.2172/3015059

DO - 10.2172/3015059

M3 - Presentation

T3 - Presented at the International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), 28-30 October 2025, Anaheim, California

ER -

2025 InterPACK: Thermal Management and Reliability Aspects

Abstract

Publication series

NLR Publication Number

Keywords

Access to Document

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Cite this